Used FICONTEC BL 2000 #9158478 for sale
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Sold
ID: 9158478
Vintage: 2007
Flip-chip bonder
Fully automatic
Die attach with active aligning
Accuracy: 1-2um
Indium and Au/Sn soldering
Alignment with up to 6 axis
Solder temperature: 400°C
High heating and cooling rate
Inert gas supply
Options:
Automated optical facet, P-and N-side inspection
Currently stored in clean room.
2007 vintage.
FICONTEC BL 2000 is an all-purpose adhesive bonder designed to help streamline production and improve process efficiency. This versatile solution is capable of a variety of bonding techniques, allowing it to handle an extensive range of applications in automotive, electronics, medical devices, and other industrial settings. BL 2000 is a modular equipment with exchangeable modules to enable flexible operation and a variety of adhesive applications. It features a stepper motor driven XYZ drive system and a dielectric heating unit to ensure bond quality and stability. The machine is also equipped with an intelligent operating tool to ensure precise and reliable control. FICONTEC BL 2000 offers a wide width range of up to 1,200 millimeter and a maximum sheet thickness of 8.5mm. It also features a number of safety features, including a mechanical principle, safety limit switch-offs as well as an automatic shut-down of the control and power systems after a specified time. BL 2000 is capable of performing three distinct bonding techniques, including thermolamination, hot-melt bonding, and thermocompression bonding. All three processes involve the use of a heat source, such as a hot-air gun, as well as the application of a specialized adhesive such as an epoxy, silicone, or acrylic. Thermolamination is ideal for bonding extremely thin parts together, resembling the 'gluing' of two parts together. The process involves heating up the parts to a certain temperature, and then pressing them together to create a permanent bond. Hot-melt bonding is suitable for a larger variety of materials, such as metals and plastics. This process involves melting the adhesive to form an even film before pressing the two parts together to form a secure bond. Thermocompression bonding is the process of using a heated-platen to generate a strong bond by introducing a combination of temperature, pressure and time into the joining process. This offers the advantage of higher production yields, as well as improved stability of the bond over time. FICONTEC BL 2000 also allows for a couple of additional bonding processes including reactive bonding and induction welding. In addition, it also features advanced monitoring components, such as a force and torque sensor measuring device which can be used to control the process in order to obtain the best bond quality. Overall, BL 2000 is a versatile and powerful solution for production of products requiring precision and reliability when bonding. It provides an all-in-one package of necessary bonding processes, safety features, and monitoring components in order to ensure efficient production.
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