Used HANTEX DEVELOPMENT LIMITED Tbon-100 #293643170 for sale

HANTEX DEVELOPMENT LIMITED Tbon-100
ID: 293643170
Wafer bonding system.
HANTEX DEVELOPMENT LIMITED Tbon-100 is a high performance, cost effective, fully automatic wire and cable bonding machine. The machine is designed to automate all processes of wire bonding, including looping, bonding, and wire feeding. Tbon-100 is a multi-core device designed to produce all types of wire bonds, including, but not limited to, bonding of all types of gold, copper, aluminum, gold wire, silver wire and die bonds. HANTEX DEVELOPMENT LIMITED Tbon-100 is built with a toner, laser marking equipment capable of achieving 1 μm accuracy and wire bond angles up to 180°. The machine is equipped with a high resolution camera with multiple adjustable focus points for precision probing and the automatic loading and unloading of wire. Tbon-100 utilizes a flexible wire loop in order to reduce wire pre-tensions and minimize wire lengths for quick and effective bonding. HANTEX DEVELOPMENT LIMITED Tbon-100 is a user-friendly device that includes a color touchscreen and multiple languages, including Chinese and English. The user-friendly graphical interface and software are designed to make the operation of the system simple and fast. The machine is equipped with several functions like monitoring, reporting and configuring, data logging, and wire joining. The easy-to-use software allows users to perform a wide range of tasks including wire joining, data logging, micro looping, and report generation. The wire bonder also features a low noise design, advanced control unit, and adjustable pressure machine, which ensure better performance of welding operations. The machine is equipped with an advanced chip detection tool and a triple-level bonding capability. This efficient and reliable asset can be used in various industries such as automotive, medical, and telecommunications. Tbon-100 is a highly efficient and reliable wire bonder that has been designed to meet the highest industry standards. The machine is capable of delivering excellent bonding fidelity and fast, safe performance. This advanced machine is suitable for a wide range of applications and is extremely cost effective.
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