Used HANWHA TECHWIN SFM-8000 #9352067 for sale

HANWHA TECHWIN SFM-8000 is a high precision, state-of-the-art die bonder specifically designed for the ultra-fine-pitch markets. It can handle fine-pitch sizes down to 0.2mm, enabling high-yield production of ultra-fine-pitch die and die-attach solutions. This bonder is equipped with precision XYZ motion stages to ensure accurate die placement, a high-resolution CCD camera for part alignment, and a custom designed bonding head to provide accurate, repeatable temperature, pressure and dwell time functions. SFM-8000 is ideal for applications such as die-attach of wireless devices and power IC solutions, and provides precise and precise control of bond planarity and epoxy volume. What sets HANWHA TECHWIN SFM-8000 apart from other similar systems is its exceptional ease of use and accessibility, thanks to features like intuitive step-by-step operation and Windows-based smart software. Once the parameters are entered and the process is set, the machine runs by itself with minimal operator intervention. This makes it easy to produce tight-tolerance, high-yield wire bonding solutions. Even if there is an error in the programming, the machine will automatically stop and alert the operator about the issue. SFM-8000 is also equipped with a host of other features and components. For example, it has a dynamic flux dosing system for accurate control of flux volume for each bond. Additionally, it includes integrated vision and real-time Adjustable Height Bond Short Finder (AHB SF) for precise bond height control and real-time monitoring of bond integrity. It also features a built-in Auto-EFEM function, which provides automatic equipment setup and process start up, as well as a Heat Sterilization System to clean and sterilize molding compounds and other organic materials. Overall, HANWHA TECHWIN SFM-8000 is an ultra-fine-pitch die bonder that provides high precision, easy operation and outstanding repeatability and accuracy performance. It offers the most cutting-edge technologies to the ultra-fine-pitch market and is the perfect choice for applications requiring tight-tolerance and high-yield bond solutions.