Used HANWHA TECHWIN SFM-8000 #9352071 for sale

HANWHA TECHWIN SFM-8000 is an advanced semi-automatic die attach and wire bonding equipment designed for precision and versatility in the assembly of a variety of microelectronics components. The system comprises of a precision motion unit, a programmable vision machine and both thermal and cold welding capabilities. The precision motion tool ensures high repeatability and accuracy, allowing for placement of components to within ±4.0 μm. The programmable vision asset consists of a 5MP color camera and bright LED-backlight illuminator to ensure reliable fiducial alignment and complete component inspection. The YT-10 digital display controller optimizes parameter control in temperature and speed for weld quality monitoring. The high efficiency thermocompression die attach module enables precision placement of components with pre-defined displacements. Temperature and time are optimally controlled to ensure full intermetallic bridge formation and low temperature annealing for reliable metallurgical bonding. In addition, temperature and pressure can also be monitored before the attachment process. The variable speed wire bonder secures small pads, enabling pin-in-paste and touch-up on PMC with a bond force range of 0-1.4 N. It ensures reliable and repeatable wire bonding with fewer process steps, driven by its patented 'Jewel Core Feeder Model' and wire feeders. Wire charging and successive crimp technology provide high wire feed speed with a profile adapted to miniaturized components. The equipment is built with ergonomically designed tooling fixtures for quick component removal and insertion, eliminating tedious manual labor. The operator friendly interface ensures easy setup and control panel, and the system is also available with a pneumatic nozzle changer and a pneumatic stiff wire module. SFM-8000 is perfect for high-mix and high-volume production of microelectronics components, providing reliable and consistent performance. It is designed to provide maximum flexibility with repeatable and repeatable bonding processes. Moreover, it delivers excellent cost-efficiency and process integrity.