Used HESSE & KNIPPS Bondjet 820 #293767538 for sale

HESSE & KNIPPS Bondjet 820 is an advanced, top-of-the-line, wire and fiber bonder for high-precision chip bonding. This automated, programmable equipment is designed for high volume, cost effective, repeatable and reliable electronic assembly production. Bondjet 820 offers a choice of four interchangeable bonding tools: Vertex, Loop, Tape, and Dual-Path. Vertex tool has two individual heads for WIRE and AWG solder ball bonding. Loop tool offers ACF/FFC/ribbon/COB bonding as well as wedge bonding. Tape tool is ideal for fine pitch bonding and application of flex-to- PC boards with individual laser cut patterns. Dual-path tool accommodates high-speed scribing for laser cutting. HESSE & KNIPPS Bondjet 820's modular architecture provides a modular construction for easy switchover and flexibility. The machine delivers precision, repeatability, and user-friendly engineering with its integrated controller software and a powerful motion system. The touchscreen PC control panel provides an intuitive operating platform that is ideal for smart automation of sophisticated processes. Bondjet 820 also features two independently operated bonding heads with a sampling rate of up to 5000 bonding cycles per second for high speed production. The automatic focus unit (AFS) automatically focuses the cameras on the micro parts, and the wire and the lead frame are automatically aligned. This advanced imaging machine ensures reliable high-quality bonding. HESSE & KNIPPS Bondjet 820 is equipped with an integrated vision inspection tool that examines the bonding results for optical quality assurance. It features an integrated vertical camera for high-resolution imaging of the parts and the board. The asset can also be used for defect recognition based on image data analysis. In terms of safety, Bondjet 820 complies with all relevant ISO and ESD standards. The model is able to detect partial powder supply failure and automatically adjusts the powder flow accordingly. It also features intelligent sensing for reliable bonding process monitoring. Overall, HESSE & KNIPPS Bondjet 820 is an advanced, reliable, and efficient equipment for automated, precision wire bonding and fiber assembly production. With its modular set-up, intuitive user interface, and advanced imaging capabilities, Bondjet 820 enables cost effectiveness and accurate results with high throughput.