Used HESSE & KNIPPS Bondjet 820 #293807354 for sale

HESSE & KNIPPS Bondjet 820 is a precision bonder designed for the automated assembly of complex microelectronic components. Bondjet 820 is a high-performance bonding platform capable of producing advanced circuit patterns and bond patterns in a wide variety of materials. HESSE & KNIPPS Bondjet 820 utilizes its patented "multi-process" equipment, which combines several different processes into a cohesive and highly efficient formation. These processes include thermal evaporation, resistance welding, ultrasonic welding, laser welding, and die attach. Bondjet 820 features a patented dual-laser platform that offers both an electron beam and a pulsed laser for welding. This system is capable of producing a very high weld quality, allowing for an extremely precise control of weld quality and process speed. It can weld a variety of materials, from aluminum to copper to lead and more. The machine also features a temperature accuracy of +/- 0.1 degrees Celsius and a precision of 0.01mm on its bond pads. HESSE & KNIPPS Bondjet 820 uses an advanced vision unit to ensure accurate registration of welds and to verify the placement of any components that are to be die bonded. Bondjet 820's user interface is user-friendly, allowing operators to quickly and easily program the machine to perform the desired operation. This interface also allows users to program the machine to make adjustments to temperature, speed, bond strength, etc. as needed to ensure a successful bond. HESSE & KNIPPS Bondjet 820 can be operated in either an open or closed loop machine. The closed loop tool enables the machine to continually monitor all aspects of it's own performance, allowing for real-time control over the process and ensuring optimal outcomes. The open loop asset also allows for real-time control of the process, but does not constantly monitor the machine's performance. Bondjet 820 is an excellent choice for businesses and companies who need a reliable, high-quality bonder to produce complex microelectronic components quickly and accurately. HESSE & KNIPPS Bondjet 820 utilizes several processes for bonding, so it can handle many different applications. The machine's advanced vision model and temperature accuracy ensure that any components produced will be both precise and reliable. This machine's robust programming and user-friendly interface make it easy to setup and manage, enabling even novice operators to get up and running in no time.