Used HESSE & KNIPPS Bondjet 820 #293829159 for sale

HESSE & KNIPPS Bondjet 820
Manufacturer
HESSE & KNIPPS
Model
Bondjet 820
ID: 293829159
Vintage: 2010
Wedge bonder 2010 vintage.
HESSE & KNIPPS Bondjet 820 is an advanced bonding equipment designed for efficient and reliable bonding processes. It is an advanced epoxy bonding system customized to achieve application-specific performance characteristics. Bondjet 820 is suitable for bonding materials such as plastics, metals, ceramics, acrylics and quartz. It is a fully automated bonding unit that acts as a robot, operating semi-automatically to produce superior quality bond parts or samples. HESSE & KNIPPS Bondjet 820 features an integrated reliable bonding process to make sure that all materials are properly bonded. It uses an electronically-controlled pulse width modulation to ensure a uniform temperature at all levels throughout the entire bond application and cycle. This ensures a uniform joint strength and excellent bonding results. Bondjet 820 has a wide temperature range of 10°C to 275°C for epoxy bonds with temperature accuracy to ±3°C and temperature stability within 1°C. The bonder comes with an integrated ultrasonic transducer array and full programmable control machine for efficient and effective bond programming. The ultrasound is especially useful for heating up and forming the bond. This machine also comes with fast cycle times and an easy to use user-friendly interface. Its software features an intuitive graphic user interface for programming the bonding cycles. This graphical interface allows for real-time monitoring and feedback during bonding processes. HESSE & KNIPPS Bondjet 820 comes with intelligent thermal monitoring as well, which allows for temperature control and protects the bond joint by detecting any irregularities in the thermal conditions. This ensures adequate thermal conditions for the bond to form properly. It also offers a wide selection of power supplies compatible for use with a variety of dissimilar materials. Bondjet 820 is a powerful and reliable tool for applications such as electro-mechanical assemblies, compaction of assemblies, electrical connections, and advanced optical systems. It is a perfect choice for cost-efficient and precise bonding of materials.
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