Used HESSE & KNIPPS Bondjet 820 #293830777 for sale

HESSE & KNIPPS Bondjet 920 is a fully automated, reliable and cost-effective bonder for fast production of high-volume 3D assemblies. It is specifically designed for bonding SMD components, from 0201s to larger chip carriers, onto leaded or lead-free solder paste for optimal soldering in a single step. With its quick and accurate bonding process, it is ideal for high-volume 3D assembly production lines and provides the most reliable form of interconnection between components. In terms of its technical specifications, Bondjet 920 has a working area of 350 x 290 x 55mm, with a positional accuracy of 10µm. It is powered by a constant temperature temperature control equipment, dynamic oxide layer control and heating element system, ensuring that the bond strength is maintained under extreme conditions. Additionally, the bonder features a continuous path tracking unit, allowing it to automatically compensate for any movement of the components so that a consistent bond is achieved. The machine also comes equipped with a tooling machine, providing greater flexibility and allowing it to bond any size and type of component. HESSE & KNIPPS Bondjet 920 also benefits from a range of advanced software tools that help to reduce operational setup and programming time and enhance production throughput. These tools, such as the OPC calibration application, provide users with complete control over the process and allow for freedom to program and adjust the settings. Additionally, an advanced recipe management tool is included and allows for fine-tuning of the bond strength and process parameters. All of this is backed up by an efficient, ergonomic and user-friendly interface. Bondjet 920 is equipped with an intuitive GUI that allows users to quickly set up and fine-tune parameters. Additionally, the bonder's full capabilities are revealed through the powerful and easy-to-use material transfer utility, while asset diagnostics and maintenance features keep the machine running efficiently. Overall, HESSE & KNIPPS Bondjet 920 is an excellent choice for high-speed and high-precision bonding for 3D assembly production and has been praised for its reliability and cost-effectiveness. Its range of software tools, advanced technology and user-friendly interface make it a great choice for any 3D assembly line.