Used HESSE & KNIPPS Bondjet 820 #293830864 for sale

HESSE & KNIPPS Bondjet 820 is an advanced industrial bonding system designed for use in multiple applications ranging from the mainstream consumer device bonding to the high performance, precision-sensitive industrial applications. It has the capability to bond a variety of substrates such as chip substrate, IC encapsulation epoxy, fiber reinforced epoxy, Kapton and other polymers for industrial purposes. Bondjet 820 utilizes advanced infrared matrix laser technology and digital signal processing to provide efficient and uniform heating of the material and create strong bonds between the interfaced surfaces. The adjustable power, pulse frequency and width, beam angle, and scan speed parameters allow the operator to tailor the bond parameters to the desired application. HESSE & KNIPPS Bondjet 820 provides a rapid and accurate bond solution which is further enhanced by its high speed optical focusing system, which allows accurate positioning and scanning of the entire flash area. Its X/Y axis stage, which incorporates a precision spindle and stepping motor, smoothly controls the disposition of the substrate in the scan plane, delivering accurate and repeatable scanning even on unmovable objects. Bondjet 820 is equipped with automatic temperature control, which ensures all bonds are created within the optimal range. An integrated temperature sensor measures and controls the temperature, allowing exponential temperature ramp up at the start of a bonding cycle, and preheats the substrates in order to ensure optimal bonding performance. HESSE & KNIPPS Bondjet 820 is further enhanced by its integrated diagnostics. This provides a comprehensive view of the process parameters, including the pre-set alarm conditions, the actual data point readings and the estimated energy consumed at the target bond. Bondjet 820 also comes with a built-in automatic waste treatment system which offers effortless disposal and minimizes environmental impact. Overall, HESSE & KNIPPS Bondjet 820 is an advanced, efficient and reliable bonder which is ideal for a wide range of applications. It provides excellent bonding performance, complemented by its intuitive UI and powerful diagnostics, allowing users to customize and fine tune the bonding process according to the specific application.