Used HESSE & KNIPPS Bondjet 820 #9390764 for sale

HESSE & KNIPPS Bondjet 820 is a reliable and incredibly efficient bonder designed for microfabrication. It is a highly advanced and precise bonding tool that meets the demands of both industrial and academic needs, allowing for the formation of reliable and low temperature bonds through a variety of materials. Bondjet 820 boasts a large workspace of 10x10 inches and two selectable, adjustable dwell profiles, allowing for flexible applications for an array of different bonding technologies. The bonded sample is rigidly held in the fixture with an adjustable air nozzle to accurately place the bonded area for optimal performance. HESSE & KNIPPS Bondjet 820's precision, accuracy, and repeatability are impressive in comparison with other bonders in the market, guaranteeing reliable results time and time again. The bonder is powered by the unique surface activation technology from H&K, which ensures low temperature and tight coupled compound bonds. This system quickly heats up wafer temperatures to 350°C. The temperature control, along with the low bond pressure, guarantees induced thermal gradient bond control, preventing any kind of heating related deformation of the wafers. For enhanced motion control, the Bondjet houses a highly reliable and efficient flat table scanner with variable speed settings and alarms for tracking system errors. It is built with two-axis movements and is independent of the external temperature control. The user interface of Bondjet 820 ensures readily available control systems that can be used with any wafer fabrication equipment. Its pre-configured controller setting is intuitive and user-friendly, allowing for quick access to the control systems and adjustment of the micron levels. HESSE & KNIPPS Bondjet 820 has been successfully employed in the academic and industrial sector for the production of semiconductor devices, photomasks, and many other micro-electrode mechanical systems (MEMS). Its autonomous nature, flexible workspace, adjustable air nozzle, temperature control, and two distinct protective mechanisms make it the perfect choice for any microfabrication need. Thanks to its low-temperature bonding, Bondjet 820 provides a secure and reliable platform for even the most sensitive of bonding applications.