Used HESSE & KNIPPS Bondjet 855 #293647287 for sale
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ID: 293647287
Vintage: 2019
Wire/Wedge bonder
Bond head, 45°
Transducer, 94 ±2 kHz
Frequency: 100 kHz
Wire material: AI, Au, Cu
Bridging force: 10 cN to 200 cN
Length of the wedge, 1"
Maximum depth insertion height: 14.5 mm
Wedge speed: 7 wires/s
Coaxial lighting: Box light
Ring lighting: white
PQC
Wire thickness:
AI, Au: 17.5 µm -50 µm (0.7 mil - 2.0 mil)
Cu: 12.5 µm - 50 µm (0.5 mil -2 mil)
Range: 12.5 µm - 50 µm (0.5 mil -2 mil)
2019 vintage.
HESSE & KNIPPS Bondjet 855 is a state-of-the-art bonder for precision application and dispensing of adhesives and sealants. This robust machine is engineered for the automated bonding and assembly of large, curved or flat substrates. Bondjet 855 has several features which make it an ideal choice for large-scale bonding and joining projects, including its high speed, precise control, and easy maintenance. HESSE & KNIPPS Bondjet 855 uses a new generation of precision control systems to accurately dispense and apply adhesives or sealants at speeds of up to 7000rpm. The dynamic control of Bondjet 855's servo controlled drive system and advanced digital weighing technology ensure that a precise amount of adhesive or sealant is dispensed on each substrate. Its applicator calibrates automatically and reduces the concentration of adhesive for each application. For substrate sizes up to 3m in diameter, the automated linear planar movement of HESSE & KNIPPS Bondjet 855 ensures a uniform application. The main components of Bondjet 855 are controlled with industrial grade components that are built to last. The robust stainless steel frames and components have an IP66 rating, making HESSE & KNIPPS Bondjet 855 highly resistant to dust and water. Bondjet 855 is designed to remain precise and repeatable in production and comes with a range of user-friendly features including a color display, heated application station, one-touch control system, and a safety interlock for the dispensing nozzle. HESSE & KNIPPS Bondjet 855 is easy to maintain and requires minimal servicing and setup. The maintenance process requires only simple tools and components and the machine can be fully disassembled without the use of special tools. The platform of Bondjet 855 is also designed with two separate entrances, allowing for easy access to the components. HESSE & KNIPPS Bondjet 855 is the perfect solution for a plethora of industrial bonding applications, from packaging to automotive components to medical technology. With its easy maintenance, precise application, and user-friendly features, Bondjet 855 is sure to meet any of your production needs.
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