Used HESSE & KNIPPS Bondjet 920 #293670025 for sale
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HESSE & KNIPPS Bondjet 920 is a compact, high-performance, micro-miniature wire and ribbonbonder for the fast and precise connection of copper metallization on printed circuit boards, substrates and components. The smaller footprint of Bondjet 920 compared to other bonders enables the placement of multiple positions close together, allowing for high throughput and the connection of micro-miniature wires and ribbons. Furthermore, the tool's integrated Vision Alignment System (VAS) ensures precise positioning through automatic recognition and alignment of the component leads. HESSE & KNIPPS Bondjet 920 can handle wires and ribbons ranging from 0.1 to 0.9 mm in diameter and 0.1 to 2.2 mm² in size, with a maximum bond gap of 750 µm. It is equipped with an adjustable head for delicate placement of micro-miniature wires and ribbons. To ensure the bond quality, Bondjet 920 is equipped with ultrasonic sensing to monitor the resistance of the bond, and offers weld pressure control for uniforming breath and forming of parts. From a process control standpoint, the machine features maximum uniformity control, looping speed, welding head speed, and bond force profile adjustment. HESSE & KNIPPS Bondjet 920 also allows remote access control with a user-friendly graphic touch-screen, giving the user the ability to monitor the whole process and adjust parameters for different wire size and shape or connection types. There is also a built-in reporting function that allows for easy documentation. Bondjet 920 is a reliable, highly accurate bonder that is suitable for a wide range of applications. Its reliable drive system ensures trouble-free operation even in the harshest conditions. With its easy-to-use interface and capable electronics, this machine offers a precise, safe and cost-effective solution for any micro-miniature bonding work.
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