Used HESSE & KNIPPS Bondjet 920 #293799141 for sale

HESSE & KNIPPS Bondjet 920 is an advanced die attach machine designed for high-volume production of semiconductor packaged devices. This machine is capable of dispensing and attaching thermally conductive paste, flux, solder or hybrid material. It is suitable for most product applications where high accuracy and narrow bonds are required. Bondjet 920 features a stable mechanical frame and a smooth motion equipment that allows for fast accelerations and decelerations. This ensures the accuracy and repeatability of the bonding process to create reliable electrical connections. HESSE & KNIPPS Bondjet 920 is equipped with a computer-controlled dispenser, allowing for precise dispensing of paste, solder and flux. The machine also has two integrated high-precision applicators that ensure for accurate placement of the paste, solder and flux onto the bonding pads of the device. Bondjet 920 utilizes a camera and software vision system to confirm the part is correctly aligned and positioned prior to the bonding process. This unit can detect the chip's bonding pads and detect and compensate for misalignments. HESSE & KNIPPS Bondjet 920 uses a specially designed vacuum machine that holds the parts in place while maintaining accuracy and providing superior repeatability. This vacuum tool has a liquid crystal display (LCD) that provides the user with feedback on the vacuum pressure inside the machine. Bondjet 920 has a number of safety features including a two-dimensional laser scanner asset that ensures the machine does not attempt to attach components to the wrong parts. It also has a sensor that automatically shuts down the machine if it detects an abnormal temperature or pressure variation. HESSE & KNIPPS Bondjet 920 can function in three modes: automatic, manual and semi-automatic. In manual mode, the machine can be used to parse solder and flux batches, while in automatic mode, Bondjet 920 can be used for rapid batch-feeding and die splitting. The semi-automatic mode is used for rapid prototype development. HESSE & KNIPPS Bondjet 920 is designed for automated production capability and is one of the most advanced die bonders on the market. This machine can increase the production efficiency of semiconductor packages and lower the cost of device production.