Used HESSE & KNIPPS Bondjet 920 #9232202 for sale

Manufacturer
HESSE & KNIPPS
Model
Bondjet 920
ID: 9232202
Vintage: 2006
Wedge bonder 2006 vintage.
HESSE & KNIPPS Bondjet 920 is a fully automated medium to high volume PCB bonding machine designed for ultra-speed PWB bonding. It is capable of automatically bonding with two phases at the same time, allowing production speeds of up to 8600 parts per hour. Bondjet 920 is equipped with a powerful five-axis robot code-scheduled system for maximum efficiency, accuracy and repeatability. This efficient automated bonding system allows for rapid and high quality production of PCB with reflow and epoxy bonding processes. HESSE & KNIPPS Bondjet 920 features a high performance bonding head, capable of automatically simulating and verifying proper bond strength before applying the glue. With this precision head, Bondjet 920 is capable of performing accurate and consistent bonding even when operating in a high-volume environment. It also features a versatile and reliable controller that is designed to maximize accuracy and repeatability of the bonding process. HESSE & KNIPPS Bondjet 920 comes with a range of advanced features such as variable glue temperature, adjustable pulse dwell time, adjustable pulse energy and power levels as well as an intuitive user interface. It can also be equipped with additional components such as a hot air unit to increase the accuracy and speed of the bonding process. Another notable feature of Bondjet 920 is its cabinet design which allows for easy maintenance and repair. The high quality and speed of HESSE & KNIPPS Bondjet 920 make it ideal for PCB short runs of medium to high volume boards. This reliable and efficient system can produce high quality and repeatable results even in a demanding production environment. Furthermore, the machine is designed to save time and money by providing accurate and consistent bonding in less time than manual methods. Overall, Bondjet 920 is a great option for applications that require high speed and quality bonding processes.
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