Used HISAMOTO SB-802 #293600789 for sale

HISAMOTO SB-802 is a high-performance manual microscopic bonder and it is widely used in the fields of flip chip, chip on board and MEMS applications. It is ideal for low cost, high quality and on-the-spot repairs. The machine is specifically designed to deliver high-speed, high-precision, and reliable wire bonding and ribbon bonding in order to meet the most demanding customer requirements. It features easily adjustable working distance, precise manual manipulation for precise control and is highly resistant to vibration and shock. SB-802 comes equipped with a 0.5 to 4.5 mm working distance to accommodate different materials and process parameters. It is equipped with a proprietary high-speed wire bonding technology, which ensures outstanding process throughput and very high precision for each wire in the bonder head. Due to its "Automation Made Easy" design it can be easily integrated into an automated system with minimal additional setup. Additionally, it has an advanced power supply design to ensure accurate control of power levels and temperature. The bonder has a unique visual display and a touch panel, which provides easy access to the user interface. The touch panel also includes a detailed service log, which allows user to reference the set parameters and analyze the repair results. With its built-in 'Plan' function, setting of the wires in the loop and punch are simple and easy. The bonder can store up to 32 different plans for easy repeatability. HISAMOTO SB-802 features a very robust construction for the highest reliability in fields such as automotive or medical environment. It has an environmental resistance in its housing to meet the requirements of any international standard. Its temperature range is from -5°C to 100°C, with an optional mechanical drain valve on the side for cleaning. SB-802 appears as a highly reliable and efficient bonder. Its features make it an ideal solution for wire bonding and ribbon bonding applications in industries like automotive, electronics and medical device manufacturing. The set parameters for time and force can be easily adjusted and stored in the machine, allowing for the fast rate of quality production.