Used HITACHI 6130 #293621028 for sale

Manufacturer
HITACHI
Model
6130
ID: 293621028
Die bonder Power: 32 W - 37 W.
HITACHI 6130 is a state-of-the-art bonder consisting of a high-performance, precision piezo actuator and control unit. This combination of technologies allow the device to offer unmatched accuracy, speed and control when bonding a range of circuit board components. CAPACITIVE ABSORPTION technology is employed for a precise, immediate reaction to altering temperatures and ensuring a high degree of process repeatability. The bonder is designed for efficient and reliable usage in high-volume production environments, therefore it is configured with a robust controller and powerful transistors for simple and precise operation. 6130 is an advanced fiber bonding system featuring active fiber motion compensation, 3D fiber recognition, pulse width control, independent fiber temperature control, and advanced spooling technology for precise fiber deposition. The system uses an intuitive graphic interface to guide the user through the functions including wire length, wire diameter and wire tension control. Its reliable and robust design offers uncomplicated maintenance and service. The machine is also equipped with advanced safety features including active load cell monitoring, ESD protection, and head end protection. In addition to its bonding capabilities, HITACHI 6130 also provides functional testing capabilities to ensure reliable quality results. This includes continuity checking, insulation resistance testing, temperature measurements, and fault location. The machine is further equipped with an integrated laser scanning system to identify fault locations quickly and accurately. The laser scanner is capable of measuring the height and thickness of components with a resolution of 0.0003 inches. To ensure repeatability, the device can be pre-programmed with nine parameter sets to store job information such as setup parameters, test parameters, and process control parameters. Overall, 6130 is an exceptionally well-functioning bonding tool for use in high-volume production areas. Its robust design, high performance features and advanced safety features make it an ideal choice for any circuit board manufacturer. With its reliability and quality results, the device offers an efficient and reliable production solution.
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