Used HITACHI LM 500 #9041831 for sale

HITACHI LM 500 is a microprocessor-controlled, high-density wire bonder equipment designed for precision bonding in the production of semiconductor devices. It is equipped with a 3-axis adjustable head frame and a high-speed, high-resolution servo drive for highly precise light guide and bonder alignment. HITACHI LM-500 uses a removable bottomshield platform to provide highly reliable wire bonding operations in a wide variety of pitch and package combination applications. The system is designed with an auto-seam feature that automatically finds and aligns the axis of the internal parts of the seam. It also features an adjustable seam sensor for added accuracy. LM 500 provides fully programmable wire bond parameters to enhance productivity and flexibility. The unit is constructed with high-precision ball bearings and stainless steel housing for increased endurance and stability. The machine is capable of boththermosonic and thermocompression bonding. It uses a high frequency AC electronic spark to ensure quick heating of the wire and resulting quality. It is also equipped with a high-resolution micrometer-controlled measuring tool to guarantee consistent bond quality. LM-500 is designed for easy operation and set up. It features teach-ins and a 24-key operation pad with LCD display for programming, diagnosis and status reports. The user-friendly design allows operators to easily adjust settings and check results without having to refer to a manual. The asset is incredibly versatile and can handle both high- and low-volume productions. It is also designed with an automatic adjustment mechanism that automatically adjusts the bond head position based on the height of the wire being bonded. This eliminates the need for manual repositioning and reduces fatigue over long bonding process runs. HITACHI LM 500 is environmentally certified as it meets EPA and CARB standards. The model also has an option to support multi-head systems which further increases its flexibility.