Used HITACHI LM 500 #9051935 for sale

HITACHI LM 500 is a semiconductor wafer die bonder and wire bonder with an automatic vision alignment equipment. The machine supports a variety of die and wire bond mechanism, for optimum quality and flexibility. It is designed for high-volume production lines, as well as bonder-to-tester compatibility assurance. HITACHI LM-500 provides a powerful yet easy-to-use automation system for die bonding and wire bonding. The intuitive touchscreen interface allows users to access the required functions quickly and easily, while a variety of motion control parameters can be set to customize the operation of the bonder. Additionally, the machine features an automatic vision alignment unit which allows for precise placement and bonding accuracy. The machine is capable of handling a wide variety of die sizes and pitches, and can be equipped with either a stainless steel or ceramic application tool for optimal speed and accuracy. Furthermore, a low temperature bonding option is available to accommodate sophisticated die technology. The machine also features a unique user-replaceable parts machine which simplifies maintenance and repair operations. LM 500 offers a strong and reliable bonding process with a number of advantages over traditional bonding processes. The machine is equipped with a adjustable die and bond force, as well as a vacuum hold down tool to ensure the best force control during the bonding process. This minimizes movement and allows for precise alignment, leading to stronger bonds. Additionally, the machine also features an adjustable pulse bonding asset for reduced heat and improved bond properties. LM-500 is an ideal solution for die and wire bonding in high volume production lines. Its easy to use interface, automated vision alignment model, and adjustable bonding parameters provide users with a reliable and efficient bonder that will boost productivity and efficiency in the production environment.