Used HOSON GS100AH-PA #293626954 for sale

HOSON GS100AH-PA is a precision bonder equipment using vacuum pick up technology for the bonding of wafer level packages. The system utilizes a combination of revolutionary high-precision pick-up and bonding technology to reliably and accurately pick up, place and bond semiconductor wafers with exceptional precision. With an enhanced vacuum source design allowing for consistently repeatable, low-force pick-up, GS100AH-PA is well-suited for die-attach and low-temperature die-bond processes. HOSON GS100AH-PA features a high-accuracy pick-up unit with 0.05mm repeatability, improving precision and enabling accurate die placement. Additionally, this high-accuracy pick-up machine is equipped with a fast simultaneous X,Y and Z alignment, which allows the tool to quickly acquire the desired pick-up position. The intuitive touch-screen user interface and software provide easy program creation and control for more efficient process development. GS100AH-PA features multiple bonding configurations, including die-attach and die-bond. The die-attach process uses a low-temperature adhesive to securely and ultra-precisely place the die onto the wafer or substrate. For die-bond processes, the asset incorporates advanced pressure control technology, providing precise and uniform bonding forces to minimize die-bond interface resistance. HOSON GS100AH-PA also features a high-resolution CCD camera with a pixel resolution of 4.1μm x 4.1μm, andwith 50-fold zoom capability. This camera can control die locations with high accuracy, allowing for precise grasp and distal placement of die from the main body of the component. Also, this camera can calculate the temperature coefficients of the wafer components and ensure precise, accurate measurement when scaling body size and judging component rotation. In conclusion, the robust and reliable GS100AH-PA is ideal for precise and accurate die-attach and die-bond processes for precise, reliable and high-yield semiconductor device manufacturing. With its precise positioning and high quality pick-up systems, HOSON GS100AH-PA ensures accuracy and repeatability for reliable, precise device component placement and bonding.