Used HOSON GS128V #9384544 for sale

HOSON GS128V is a high-performance bonder for automated die-attach processes. It is designed to automate Semiquantitative Die Attach Process (SQDAP) applications with accuracy, speed and reliability. At the core of the equipment lies its advanced algorithms that enable repeatable and accurate die placement with a tolerance of only 15µm. It enables contact-bonding, soldering-bonding, hot-bar-bonding, and conductive-glue-bonding applications in a single system and offers several value added features. GS128V boasts an integrated vision unit, providing an accurate die locating and end-of-arm-tool (EOAT) tip assembly. It features a full-stereo glass vision camera which accurately captures die images and automatically adjusts die location to the reference point with a tolerance of 15µm. It also monitors die geometry and center points using an in-built camera machine. The vision tool is connected to the device control unit, which gives accurate feedback for controlling the position, movement and profile of the application. Furthermore, the unit is also capable of providing a highly consistent and repeatable performance across different types of dies. This device also features a heating module which is used to precisely control temperatures for soldering and hot-bar-bonding applications. The heating module supports temperatures ranging from 100°C to 600°C for accurate and quick thermal transitions. The heating module is integrated with the machine's vision asset. This allows the machine to compare the heating pattern to the die patter in order to determine the heat profile settings. HOSON GS128V also features a high-precision end-of-arm-tool (EOAT). The arm of the EOAT is fitted with an integrated scanning ring scanner, which is capable of scanning and detecting the exact position of the target die. The End-of-Arm-Tool also consists of a three-axis wrist unit for precise and accurate die pick, place and align. The arm is also equipped with a micro-mesh motion technology which provides a smooth and jerk-free motion without losing synchrony between the die and the EOAT. Finally, GS128V also supports contact-bonding, soldering-bonding, hot-bar-bonding, and conductive-glue-bonding applications, which can be used with repeatable performance. The machine's data management capabilities also provide real-time data analysis and quality control and reporting. All in all, HOSON GS128V offers precise die placement with speed and reliability, making it an ideal machine for that automated die-attach process.