Used HOSON HDB 688V-01 #9384545 for sale

Manufacturer
HOSON
Model
HDB 688V-01
ID: 9384545
Die bonder.
HOSON HDB 688V-01 is a state-of-the-art bonder designed to offer superior bonding strength, low thermal resistance, and high production throughput. This flexible and reliable equipment features the highly advanced Streamlined Electronic Substrate Interface Technology (SEST) and Intelligent Light Controlled Adhesion (ILCA) to accurately detect and control bonding processes. This enables it to automatically calculate the optimal bond parameters and set the sample's temperature, voltage, and time parameters in order to ensure the highest quality and uniformity in bonding results. Furthermore, this high-precision bonder features a flexible process range for different substrate materials such as glass, polyimide, and soft boards, making it ideal for manufacturers with diverse substrate types. HDB 688V-01 offers enhanced bonding reliability, as it utilizes active vibration isolation and dynamic compensation to eliminate thermal drift and vibration. Its precise and repeatable process control capabilities including auto-refresh rate control, differential temperature control, and programmable temperature adjustment enable efficient and high-yield operations even under low temperature conditions. The thermal energy management system also ensures that heat is dissipated rapidly and evenly, further reducing potential for thermal damage. HOSON HDB 688V-01 offers great production throughput, as it offers the widest contact area of all HOSON series bonders, and allows up to 16 substrates to be processed at once. It also has an Intelligent Bond Process Integration System (IBPIS) to enable the automation of complex processes. Users can also quickly set up the bonder using the intuitive preset key and multiple communication ports. HDB 688V-01 also offers programmable software and I/O set-up, fully recordable optional log history, automatic overdrive protection, and unlimited recipe storage - making the bonder highly programmable and customizable to suit a wide range of application needs. Overall, HOSON HDB 688V-01 is a top-of-the-line bonder that offers great reliability and superior performance in a variety of bonding applications. With its advanced SEST and ILCA technologies, superior production throughput, flexible process range, and intelligent programming and automation capabilities, HDB 688V-01 is an excellent choice for manufacturers looking for a reliable and robust bond solutions.
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