Used HOSON HDB 810P #9380161 for sale

HOSON HDB 810P bonder is a tool that is used in precision microassembly operations, and is designed to improve accuracy and throughput in a wide range of industrial, commercial and medical bonding processes. HDB 810P utilizes innovative high frequency, infrared heating technology to melt the thermally conductive bonding activated material as it's applied between two substrates. When used in combination with HOSON precision microtooling, it has the capability to produce small scale products with exacting geometries at unmatched reliability and accuracy. HOSON HDB 810P has a 0.1mm accuracy rating for laser alignment and registration, and is capable of aligning and bonding two substrates in a single stroke at an accuracy rate of 1 micron. The repeatability rate is .01 of a micron, thus allowing products to be produced with greater speed and consistency. HDB 810P is a modular system that allows for easy tooling changes and maintenance. The vacuum controlled arm also offers superior balance when bonding substrates of different thickness or material Surface tension. Additionally, the bonder is equipped with a variety of standard materials that can be manually dispensed or applied using the integrated welding and/or laminating tools. HOSON HDB 810P is a complete solution featuring real-time microprocessor control and graphic based software that allows it to be programmed to meet any production demands. Not only does the bonder provide powerful production capabilities, it is also able to scan and scanalign materials during the process, increase production speed and accuracy, and provide real-time process verification and graphical display capabilities. Additionally, HDB 810P has been designed with safety in mind, featuring several internal and external sensors that will stop the process should any hazardous conditions be detected. HOSON HDB 810P bonder is a powerful tool that is capable of producing small-scale products with exacting geometries at unmatched reliability and accuracy. Its innovative heating technology and real-time microprocessor control allow it to quickly and accurately complete complex bonding tasks. Additionally, its modular design and suite of industry standard materials make it an ideal solution for a wide variety of industrial, commercial and medical applications.