Used HOSON HDB 852P-A #9386316 for sale

HOSON HDB 852P-A is an advanced semi-automatic bonder used to bond, assemble and package all types of materials such as ceramic, plastic, metals, PCBs and many others. It is a highly efficient and accurate bonder suitable for high volume and complex assembly jobs. HDB 852P-A is a state-of-the-art semi-automatic bonder that features a sleek and slim configuration. Its weight and size are significantly reduced from earlier series to ensure maximum accuracy and easy operation. HOSON bonder is equipped with a newly designed robotic arm with an aperture height and selection capability of up to 18 mm, which enables it to quickly and accurately align and bond components for repeatability and accuracy. It is also designed with an advanced pick-and-place system that effectively manages the complete bonding control. The pick-and-place system can be used to set up and adjust pre-programmed parameters for the exact positioning of wires and components. HOSON bonder is also integrated with a wave soldering platform, allowing it to perform complex circuit board and wave soldering processes. HOSON HDB 852P-A is also integrated with highly advanced diagnostics and feedback tools,which help in monitoring the alignment, temperature and pressure of the bonding process, allowing operators to make the necessary adjustments quickly in order to improve the performance. Additionally, it is also equipped with edge-cutting blades, which enable the operator to cut off excess material such as wires, connectors and PCBs with great accuracy. HDB 852P-A is designed for fast and reliable operation, with its robust construction, efficient automatic function and robust safety system ensuring safety and accuracy of the bonding process. It is also integrated with software-based monitoring and feedback systems, allowing operators to easily monitor the bonder's performance from a remote location. All in all, HOSON HDB 852P-A is the ideal choice for complex and high volume bonding jobs.