Used HOSON HDB 852P #9303176 for sale

HOSON HDB 852P is a state-of-the-art bonder, designed for heat-free bonding and wire-free, high-density packaging applications. This high-performance bonder is designed to provide precise, high-yield operation with a high level of productivity. It features an advanced fiber-optic transport equipment, allowing precise control of the wire-free process. It is capable of bonding ICs, discrete components, and packages with an accuracy of 0.2% or better. The high-output bonder is also capable of handling wires as thin as 0.003 inches, allowing for smaller and highly flexible package designs. This bonder has a high-resolution monitor, allowing users to easily monitor the entire process, and is equipped with an advanced diagnostic system, allowing for easy troubleshooting. The high-precision microprocessor-controlled unit provides assurance in cycle time, program data memory, repeatability, and overall accuracy. The robust and reliable design is made with a precision vacuum machine with an auto-calibration feature, and can be programmed to optimize the wire-free process for each application. HDB 852P also provides a complete control package, which includes Graphic Interface Software and a pass/fail tool for quick set-up and easy troubleshooting. Additionally, it is designed with support for a variety of programmer types and is compatible with cell-based, batch process, and traditional assembly systems. In summary, HOSON HDB 852P is a high-performance bonder that is ideal for heat-free, wire-free, and high-density packaging applications. It features an advanced fiber-optic transport asset, high-resolution monitor, advanced diagnostic model, high-precision microprocessor-controlled equipment, precision vacuum system, and complete control package.