Used HOSON HDB 852P #9303177 for sale

HOSON HDB 852P is a high-performance bonder designed for precision and consistency when bonding wires, componenets and other electronic components. It is ideal for applications that require complex electronic assembly. HDB 852P bonder features an intuitive touchscreen interface for controlling the parameters for each bond ‐ adjustable temperature, up to 400°C, capacitor discharge time, current, voltages and more. It is equipped with a heat exchanger for temperature consistency as well as a cooling fan for rapid cooling of the heated components. HOSON HDB 852P bonder also has a microprocessor that monitors the parameters to ensure precise results and heating times. HDB 852P bonder features a built-in adjustable spot welding head and adaptable feet to ensure the bonder is positioned precisely and securely. The adjustable spot weld head can be moved up or down to form the correct bonding distance and depth. It is also designed to limit arcing when the capacitor is discharged during the bonding process. HOSON HDB 852P bonder is equipped with a vacuum chuck that is designed to hold small components tightly and securely during the bonding process to avoid slippage. In addition to spot and wire bonding, HDB 852P bonder also has an integrated Power Amplifier Control (PAC) system that allows for the trapping of energy in the form of audio, visual, thermal, and motion signals, allowing for fine-tuning of the bonding process. This PAC system provides for accurate, consistent and repeatable control of the bond formation. HOSON HDB 852P bonder is designed to be both lightweight and highly portable, making it ideal for use in laboratory, production and field settings. It is also designed to be easily maintained and cleaned. HDB 852P bonder is also equipped with a built-in fault diagnostic system and an internal safety switch for protecting the operator from electric shock. HOSON HDB 852P bonder is an excellent choice for any high-intensity bond applications that require precision, consistency and repeatable results. Its robust design and advanced features make it the perfect choice for any technician or engineer looking for a solution for their precision bonded components.