Used HOSON HDB 852P #9303181 for sale

HOSON HDB 852P
Manufacturer
HOSON
Model
HDB 852P
ID: 9303181
Vintage: 2013
Die bonder 2013 vintage.
HOSON HDB 852P is a digital semiconductor bonder designed to meet the needs of high-volume production applications. This bonder has a semi-automated setup and is capable of bonding at speeds up to 32,500 bonds per hour. HDB 852P features a unique, adjustable mirror that allows the individual operator to perform high speed and precision bonding for a wide range of applications with a single machine. HOSON HDB 852P can be programmed to make a wide range of bond types such as thermosonic gold, copper, and aluminum wire bonding, gold ball bonding, gold wedge bonding, as well as ribbon bonding. The machine features the most popular bonding options, including the latest state of the art emission and de-emission ports for small chip, die, and fine pitch bond types. The equipment also offers integrated software that provides advanced functions such as pattern setting, bond parameters input, bond sequence files, and bonded device history. The machine's design is based on an advanced mechanical system for superior ball-bonding performance that utilizes vertical movement and improved wrist stiffeners. The unit features a high-precision, six-axis head and tooling designed to achieve best in class operation. The machine is also equipped with a powerful cooling tool to ensure proper operation and to reduce device damage caused by overheating. HDB 852P also offers a range of safety features to reduce risk of injury. This includes anti-static controls, a dust-collection asset, and a vision model that helps users avoid production issues caused by incorrect placement and improper bonding. Additionally, the machine is designed to keep up with industry trends with its built-in software upgrade feature, allowing users to upgrade the equipment when needed without taking the machine out of service. Overall, HOSON HDB 852P is designed to offer a versatile solution for high-volume, high-quality, accurate bonding operations. With its advanced mechanical design, powerful cooling system, and a wide range of safety features, this bonder will deliver reliable, cost-effective performance for many years of in-house production.
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