Used HTC DAML- 2500 #9150913 for sale

HTC DAML- 2500 is a bonder, a machine that is used in the assembly process of precision optical components. Bonder technology functions by melting two substrates together in a single process. This is done to produce strong optical bonds that are necessary for the manufacture of a wide range of optical and optoelectronic components. DAML- 2500 bonder works through a process called frit bonding. In this procedure, a material with a low melting point is used as a binder between the two substrates, forming a physical and mechanical bond. The bonder is equipped with a sophisticated turntable system that accurately places and bonds substrates with an automated process that can reach speeds up to 250 bonds per minute. It also has a temperature control system to keep the substrates at the desired temperature and has a reaction chamber that seals the substrates and ensures a complete and uniform bond. HTC DAML- 2500 has a wide range of features, including the ability to bond flat, curved or uneven surfaces, and several different types of optoelectronic chips and die materials. It has a high accuracy and repeatability, with a bonding area of up to 8 inches. Additionally, the bonder is built with a double-sided platform for maximum efficiency and is capable of working in harsh or dusty environments. The combined features make the bonder ideal for precision optical components and applications, such as confocal lenses, fiber-optic components, quartz resonators and LED components. Overall, DAML- 2500 bonder is a versatile and reliable tool for creating strong and accurate optical bonds. It is capable of meeting the demands of a wide range of optical and optoelectronic applications, and its consistent performance and high speed capabilities make it a valuable asset to any precision optical component assembly process.