Used HTC DAML- 2500 #9194193 for sale

HTC DAML- 2500 is a high-performance, state-of-the-art bonder designed for use in a variety of applications. It is a wire-bonder designed to provide uniform bond-to-die connections of both copper and aluminum clad materials. The wire-bonder utilizes a patented quick-release spool equipment, enabling the user to quickly and easily make wire connections without having to disassemble or adjust the spool. The bonder is capable of automatically manipulating fine-diameter wires, ranging from 0.25 to 1.5 millimeters, while ensuring precision connection with the die. It uses a galvanometer mirror system to finely control the position of the bonded wires. The mirror is fast, responsive, and energizing - providing an improved bond time with accuracy and precision. The bonder can achieve a maximum bond spacing of 0.5 millimeters, enabling it to create dense and uniform connections. DAML- 2500 has a number of safety features designed into the unit. It includes a temperature-stabilization unit which prevents damage to the delicate and expensive components by maintaining a precise operating temperature throughout the bonding process. The unit also features a fail-proof-detection machine which will alert the user to any failed connections. The bonder incorporates an adaptive motion control tool which allows it to instantly adjust to variations in the wire size, thus providing uniform and reliable bond strengths. The motion control asset is also designed to reduce the possibility of fatigue from repetitive motion, minimizing operator fatigue. The lightweight and compact design of HTC DAML- 2500 makes it easy to transport and store. The unit is equipped with a comprehensive display model which makes it easy to understand and operate. The convenient user interface also allows the user to quickly configure the bonder for a variety of applications. DAML- 2500 allows for quick connection of both copper and aluminum clad bonding wires, enabling the user to create durable and reliable bonds.