Used HTC DAML-2500 #9243761 for sale
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ID: 9243761
RFID Flip chip bonder
Inlay bonder, 5"~8" wafer
Dispense ACP+Au bumping bump
W Tape: 300mm
No tape slit.
HTC DAML-2500 is a fully automated, high-speed wire and cable bonding machine designed for industrial settings. This reliable and highly efficient machine is ideal for producing their larger, more sophisticated and specialized wire and cable products. It has a multi cone, dual-headed wire deliver system that can accomplish both tin solder and non-solder connections. The system is able to handle a wide range of materials including aluminum, copper, stainless steel, and many others. It is also compatible with a variety of insulation including silica gel, polychloroprene, and polyvinyl chloride. In addition to its durability and reliability, DAML-2500 is incredibly customizable. Adjustments can be set for output tension, the number of bonds in each strand, the length of bonds, the size of melt and flash, and a variety of other options. This makes it possible to program the machine for different job requirements and minimize rework while maximizing productivity. The machine handles wire diameters ranging from 0.10mm to 2.50mm and supports a variety of different bond lengths. Its highly efficient design is optimized for minimal cycle times and maximum throughput, allowing it to reach speeds of up to 400 bonds per minute without compromising quality. The integrated automatic feeder ensures accuracy by automatically punishing the wire to the spools, minimizing machine downtime. Overall, HTC DAML-2500 is an incredibly reliable and efficient machine that is designed to meet the demands of industrial applications. Its adjustable settings allow it to be programmed for multiple product requirements while its high-speed dual-head wire delivery system ensures quality output. With its combination of durability, speed, and quality, DAML-2500 is an excellent choice for those looking for a reliable bonding solution.
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