Used HUGHES 2460-2 #85262 for sale

HUGHES Instruments HUGHES 2460-2 is a bonder designed for microsecond-range, single-sided and simultaneously bonding of substrates. This bonder features a patented Micropositioner system, which can fine tune the time delay and down time parameters in the Bond Process for repeatable bonding results in production line applications. 2460-2 bonder can bond materials from the same or different families, including both conductive and non-conductive bond materials. It is typically used in the production of semiconductor devices and components, in order to create a permanent connection between two different components. HUGHES 2460-2 is especially useful when a bond needs to be formed, but one or both of the substrates are extremely thin, as the fine positioner is able to keep the contact forces under control while at the same time making sure that the bond is created efficiently. 2460-2 bonder is easy to program and use. Once the parameters for the bond have been established via the user interface, the bonder uses a three-step process to create a fully cured bond. First, the bonder preheats the substrates so that the contact time required for bonding is reduced to a minimum. Then, an electrical discharge is initiated to create an arc between the two substrates, forming a bond. Finally, a post-heat is used to complete the bonding process. HUGHES 2460-2 bonder has several built-in safety features to ensure that bonds are created without any issues. For example, the point of weld detection automatically tunes the power levels for the correct bond force and current levels. Additionally, the safety shut-down system ensures that the bond is not damaged if there is an interruption in the process. Overall, HUGHES Instruments 2460-2 bonder is a standard in the microsecond bonding production industry, offering high precision and excellent repeatability. With its easy-to-use user interface and advanced safety features, it is a reliable and convenient way to produce consistently accurate bonds.