Used HUGHES 2470-2 #139442 for sale

HUGHES 2470-2 is a high speed automated bonder that offers reliable, repeatable and accurate bonding results. With its high speed performance, it is well-suited for demanding production environments where precision and quality are essential. 2470-2 can be used for a variety of substrates, including (but not limited to) aluminum, copper, polyimide, and polyester. The machine is also suitable for environmentally safe flux-cored process. HUGHES 2470-2 has a modular design that can be customized to suit the specific needs of the user. The machine consists of three modules: a die bonder, a wire bonder, and an upper controller. The die bonder module can be used for exact placement of gold and aluminum contacts onto the substrate. It is equipped with an auto-vision system which allows the machine to detect and correct any flaws in the placement and to ensure an accurate bond. The die bonder also comes with an autofeeder and an adjustable magnification system. The wire bonder module is capable of performing both radial and linear wire-bonding operations with various thicknesses of wire. It is equipped with an automatic wire-feeder and an accurate rotary alignment system that enables the user to adjust the tension and pay-off angle of the wire before bonding it to the substrate. The wire bonder also has an electromechanical control that enables precise force control. The upper controller module provides an integrated environment for programming the machine parameters and downloading the recipes. It is connected to the two lower modules via a communication cable. This enables the users to monitor the machine status and modify the settings as needed. The user interface of the controller is also designed to be user-friendly and highly intuitive. In summary, 2470-2 is a versatile, high speed automated bonder that can be used in a wide range of production processes. Its modular design allows for customization and scalability, while its advanced features provide an efficient and reliable solution for precise and accurate wire and die bonding needs.