Used HUGHES 2470-2 #21181 for sale

HUGHES 2470-2 is an automated Thermal Bond Technology bonder designed for producing consistent and reproducible packages using thermos-sonic techniques. It is a top-of-the-line thermal bonder with a wide range of applications in the electronics manufacturing industry. The bonder has a footprint of 580mm x 420mm, and a working height of up to 2000mm. It is equipped with a 200mm x 150mm board tray to provide a stable platform for the packages to be bonded. These packages can be bonding sizes up to 150mm x 150mm x 10mm. The bonder is able to bond a wide range of materials from copper-clad laminates, IC packages, and heat-sensitive plastic materials. 2470-2 operates with a vacuum and ultra-sound chamber and has a 1 hp vacuum pump with a capacity to pull 20 mmHg (2.7 KPa) of vacuum. A direct drive mechanical audible ultrasound transducer is provided to generate high frequency ultrasound which produces the bond. A microproccessor with an operating speed of 400 MZ is used to control and monitor the bonder. Its 3.2-inch LCD display and user-friendly interface allows simple and precise operation. Furthermore, the bonder also has several safety features such as automatic shutdown and an EMF shield as well as over temperature protection. HUGHES 2470-2 is designed with long-term quality and reliability in mind, and is capable of producing bonds at temperatures up to 200°C in 30 seconds. In addition, the bonder is provided with a software program which allows for the programming of parameters for up to 99 different job setups. Overall, 2470-2 Thermal Bond Technology bonder is a top-of-the-line device that is capable of producing consistent and reliable bonds for a wide range of materials. Its user-friendly interface and various safety features make it a great tool for the electronics industry.