Used HUGHES 2500-2 #139852 for sale

HUGHES 2500-2 is a state-of-the-art bonder used for precision interconnection and die-attach bonding applications. This high-performance bonder uses digital infrared heating technology to ensure precise and efficient temperature control for a variety of interconnect and die-attach bonding applications. 2500-2 bonder is an intelligent and automated platform that combines a four-axis, motorized, XYZ programmable stage with four jig capacitance heaters. This allows for the application of vacuum, pressure, heat and cool on a heated substrate. Each heat sink on the heated stage can be precisely programmed for specific temperatures and time settings, ensuring an ideal bond with no damage to the device or substrate. Additionally, the temperature control is further enhanced by the optional four-axis, independent, and dynamically-reactive temperature regulation. HUGHES 2500-2 also features advanced user-friendly controls and diagnostics. The control panel allows for a range of settings to be adjusted, including process parameters and bond type. Additionally, this bonder features powerful, user-friendly software allowing the user to design and customize their own workflows and output process data. The full range of protection features to safeguard against failure, such as over-temperature protection, power cycle timers, and automatic re-set functions, ensures constant, reliable results. Furthermore, 2500-2 bonder can be easily integrated into any manufacturing environment, providing a whole host of benefits, including efficient operation and cost savings. Its intuitive and simple control panel, as well as easily adjustable settings, provide for complete user control and easy integration into the overall system. HUGHES 2500-2 bonder is an ideal choice for those seeking an advanced, efficient and cost-effective precision interconnection and die-attach bonding solution. Its reliable performance, flexible user controls, and powerful software make it the perfect bonder for a range of precision interconnection and die-attach applications.