Used HUGHES 2500-2 #6109 for sale

HUGHES 2500-2 bonder is a zero-residue, low-temperature machine for low-temperature bonding of IC leadframes and discrete wire bonds. The device utilizes the patented Hot Spot Heat method to ensure superior temperature uniformity throughout the entire bond area. The low temperature guarantees minimal thermal effect during bonding, making it ideal for use in a variety of sensitive applications. 2500-2 is a highly versatile bonder with multiple capabilities including physical bonding, stitching, or thermocompressing the wires to attach them to the IC leadframe. The Hot Spot heating method ensures even heat distribution on the entire bonding area and provides superior bond integrity. The selective soldering ensures only the wires directly connected to the substrate are soldered, while the others remain intact. Additionally, the two-point bondline reduces power consumption. HUGHES 2500-2 bonder features an adjustable tip-to-bond block spacing to provide high-accuracy bonds over a range of wire sizes. The operator can program pre-sets in the controller for different sizes and shapes of wire to quickly switch between them. The automated design of the bonder also provides high levels of repeatability and consistency. Designed for industrial use, 2500-2 bonder is highly reliable and durable in operation. The device has a robust design and is certified to ISO 9001, UL and CE standards. HUGHES 2500-2 is also easy to use and maintain, with an intuitive user interface. In conclusion, 2500-2 bonder is an advanced, low-temperature machine for IC leadframes and discrete wire bonding. It features Hot Spot Heat technology for even heat distribution, optimized power consumption, and adjustable tip-to-bond block spacing for accuracy. The device is highly reliable, durable, and easy to use and maintain, making it an ideal choice for a variety of applications.