Used HUGHES 2500-2 #85087 for sale

HUGHES 2500-2 is a semi-automated, benchtop bonder that offers a cost effective solution for a wide range of precision and micro-assembly bonding applications. In its standard configuration, 2500-2 includes a single-axis, large area, electrostatic and vacuum driven bonder head, offering excellent repeatability and accuracy. It is ideal for applications that require precise and reproducible bond locations such as those involving components such as LEDs, connectors, and integrated circuit packages. In addition, HUGHES 2500-2 offers an optional ionization kit for effective treatment of surface contamination which enhances bond strength and uniformity. Designed to accommodate a wide range of substrates, 2500-2 has a robust frame construction with a platform size of typical (LxWxH) 300mm x 200mm x 75mm and uses either a vacuum or electrostatic adhesive pattern, air or electrical actuators, and interchangeable heads for precise applications. It's equipped with a sensitive micro-controller to control the precise delivery of adhesive and provide highly precise motion profiles for precise bonding. This benchtop bonder also has a high sensitivity vision system to ensure precise placement of components and secure bonding. Moreover, HUGHES 2500-2 is equipped with a user-friendly graphical display and a comprehensive on-screen menu system offering comprehensive diagnostic and monitoring functions. The on-screen menu offers access to an extensive range of parameters such as speed, solder temperature, feed rate, and piece count, allowing users to adjust the machine's settings to match the specific application's requirements. It is also equipped with built-in safety features, including over-temperature and over-current protection to prevent damage to delicate components. 2500-2 is a versatile, durable, and efficient benchtop bonder designed to provide reliable bonding operations with minimal user intervention. It is ideal for a wide range of applications and offers excellent repeatability and accuracy, a competitive cost/efficiency ratio, and reliable bonding operations. With its advanced features and efficient operations, it's a go-to solution for a variety of micro-assembly and precision bonding applications.