Used HUGHES 2900-2 #6984 for sale

HUGHES 2900-2 is an advanced thermal replication bonder from HUGHES, the leader in advanced semiconductor materials and systems. 2900-2 is used for rapid, high-yield replication of semiconductor device features. It features a two-chamber, closed-cycle forced-air oven system, allowing high throughput of bonded substrates. This machine also incorporates specialized proprietary technologies to improve yields and reduce cycle times. HUGHES 2900-2 utilizes a four-axis motion platform to precisely control the movement of dies, allowing the automated formation of the device features on the substrate. The motion platform and finely-tuned software allow for the precise positioning and synchronization of the dies, ensuring optimum quality of device features. 2900-2 also features dual temperature zone and specialized pre-bonding processes, allowing for optimized processing for applications ranging from 0.5 to 6 microns. HUGHES 2900-2 also incorporates CTE (Coefficient of Thermal Expansion) matched force compensation, allowing for more precise control of thermal expansion mismatch between the dies and substrate. This ensures that the uniformal expansion of the dies and substrate is maintained during thermal process, avoiding potential distortion of the device features in the bonding process. The automated recipe software of 2900-2 allows for faster setup of the machine. This helps minimize downtime, accelerate production and improve yields. The machine also features a graphical process monitor, display the current thermal profile, pressure and substrate characteristics, allowing operators to instantly identify possible issues in the process and take corrective actions. This also helps reduce overall cost by optimizing the process, thus reducing material waste. HUGHES 2900-2 is also compatible with multiple types of substrate and package configurations, including ball/Pin, lead/clip, package-on-package, and flip chip. Additionally, the machine can be used for other processes such as etching, cleaning, and dicing. Additionally, 2900-2 was designed with safety and efficiency in mind, featuring standardized safety protections and an easy-to-operate user interface. Overall, HUGHES 2900-2 is an advanced thermal replication bonder that is designed to deliver high yields and faster cycle times. Its proprietary technologies and automated systems facilitate precise control of device features and uniform expansion across devices, allowing for improved yields and reduced cost.