Used HUGHES / PALOMAR 2460-5 #9103974 for sale

HUGHES / PALOMAR 2460-5 is a high speed bonder designed for use in a wide range of semiconductor packaging applications, including flip chip, wafer level, 3D, and opto-electronic packaging. It offers the ability to bond a wide variety of devices, including sensitive opto-electronic devices, to substrates, such as lead frames, flexible and rigid circuits, and PCBs. This high-performance bonder is capable of handling up to 92 mm substrates, with a bond area up to 200 x 200mm. HUGHES 2460-5 has an advanced closed loop temperature controller, which allows for a precise level of control over both heating and cooling of the substrate. It also offers a choice of four consumable dispensers for different types of epoxies, such as low voiding epoxies and allumel flux. The bonder also features a high-resolution optical microscope that can be used to view the entire bond area and to inspect the materials before, during, and after bonding. To ensure accuracy and durability, PALOMAR 2460-5 incorporates a high-speed three-axis XYZ motion system, which is capable of producing bonded items to within 0.001mm precision. With its precise control of temperature, epoxy type, and motion, 2460-5 is ideal for a range of applications, such as back end wafer level chip scale packages, 3D integrated circuit devices, and opto-electronic components. It can also be used for rapid prototyping and production of ultra thin, ultra small components, such as 3D graphic processors. In sum, HUGHES / PALOMAR 2460-5 is a high speed, accurate, and reliable bonder for a wide range of semiconductor packaging applications.