Used HUGHES / PALOMAR 2460 #293646931 for sale

HUGHES / PALOMAR 2460 is a bonder specifically designed for the production of ultrafine microelectognitive products. It is a high-performance, fully automated machine capable of performing precise micromechanical, microelectrical and thermocompression bonding operations. HUGHES 2460 bonder is built with an open-air design, meaning it is sterile and free from environmental contamination. This design is beneficial for delicate applications like the production of microelectromechanical devices, or MEMS, which are manufactured beyond microscopic scales. The open-air design also helps ensure a higher degree of temperature uniformity within the bond head, providing greater control over the bonding process. The bonder also has a refined thermocompression bonding process involving precise force and pressure control with a proportional electric drive equipment. This enabled the precise and repeatable control of the force and pressure, with a measurable range from 0.1 to 100 grams, in 0.1 gram increments. The bonder also has very precise controls that allow the user to monitor the force and pressure during the bonding process, allowing for precise and precise control of the force, pressure, temperature and humidity. PALOMAR 2460 bonder is also equipped with an integrated video system, which is used during the bonding process to monitor and record the motion of the bond head. This video unit captures a live feed of the entire bonding process, allowing the user to confirm and make adjustments throughout the process. This is done in real time and also helps confirm that the bonding was done correctly. 2460 bonder is also capable of performing a wide range of processes, from simple point-to-point bonding to complex wire bonding operations. This allows it to be used for a variety of applications, making it the ideal choice for microelectronic production lines. HUGHES / PALOMAR 2460 bonder's advanced controls and built-in recording machine have made it a reliable and efficient choice for many microelectronic production lines across the world. Furthermore, its robust design ensures that the microelectronic components are consistently bonded with high-precision and accuracy.