Used HUGHES / PALOMAR 2460 #293795089 for sale

HUGHES / PALOMAR 2460 is a bonder designed specifically for the thin-film and surface mount device bonding applications in the electronics manufacturing industry. It is an automated bonder, meaning that it is able to perform both wire bond and flip-chip/CSP bonding operations without the need for manual handling. The machine features a range of different bond heads to suit the needs of different types of applications, with different heads capable of providing micron-precision results in both Planar (straight) and Vertical (angled) bonds. It is also equipped with a positioning equipment, enabling precise placement of the bonder every time. The system also features a wide range of bonding technologies that are capable of producing bonds with different thicknesses and substrates. This includes pulse- and ultrasonic-dominated wire bonds, gold or aluminum wire, ribbon bonding, and others. It is able to form its own toe ring in only one pass, while users can also opt to configure the toe rings themselves. Moreover, the unit is also able to accommodate different combinations of bond head and substrate, allowing for choice and flexibility when it comes to producing bonds. Furthermore, the 360-degree rotatable bond head of the machine enables it to be used in highly complex configurations. This means that users can create 3D bonds instead of 2D ones, allowing them to achieve maximum precision in the production process. This also makes it more suitable for bonding larger surface packages and thin films, allowing for high-performance results in the production process. The tool also comes with a number of integrated software and control features that allow users to monitor their bond processes in real-time and increase the efficiency of their production process. These include an automated reporting asset, a positioning memory, and others that enable users to monitor their bond processes more closely. Finally, HUGHES 2460 is built to provide a long term solution to the needs of electronic device bonding operations and comes with features that provide ease and accuracy of use, making it the perfect choice for a wide range of bonding operations, from medical devices to consumer electronics.