Used HUGHES / PALOMAR 2460 #293821996 for sale

HUGHES / PALOMAR 2460
Manufacturer
HUGHES / PALOMAR
Model
2460
ID: 293821996
Wire bonder.
HUGHES / PALOMAR 2460 is a programmable, multi-functional, cost-effective semiconductor chip bonding equipment designed to provide the highest level of efficiency and quality for a broad variety of microelectronics devices and packaging. It is the ideal machine for the most challenging bonding applications in automotive, medical and general electronics industries. HUGHES 2460 offers a modular design approach for a variety of configurations allowing users to configure their system to meet their needs. It combines high-speed operation with precision and accuracy for the most demanding of applications. The CNC compatible, microprocessor machine controller provides a high level of control and automation as well as excellent repeatability and accuracy. PALOMAR 2460 features an automated wire feeder that can meet the highest standards of precision and accuracy. This unit features an integrated programmable logic controller (PLC) that can be set up to automate the entire process. The wire feeder machine is coordinated with the chip handling tool to ensure proper wire feed stability and alignment. 2460 is equipped with a high-precision bond head that offers extremely small bond joint sizes. This provides an ideal environment for the placement of miniaturized microelectronic devices and components. The bond head is designed to ensure consistent quality bonds with high precision accuracy. HUGHES / PALOMAR 2460 also features an advanced built-in vision asset for chip and pad identification and alignment. This intelligent vision model can identify and align multiple chips in a single frame, allowing users to efficiently align multiple chip taking into account their individualize sizes. HUGHES 2460 is a powerful and efficient bonder for a wide range of applications. It is designed for long-term reliability and can meet the highest levels of accuracy and precision for most challenging bonding applications. With its modular design, high precision results and automated capabilities, PALOMAR 2460 provides an ideal solution for semiconductor chip bonding.
There are no reviews yet