Used HUGHES / PALOMAR 2470-1 #32671 for sale

HUGHES / PALOMAR 2470-1
Manufacturer
HUGHES / PALOMAR
Model
2470-1
ID: 32671
auto wedge bonder, Rev. A, Aluminum wire deep access, still in box.
HUGHES / PALOMAR 2470-1 is an automated wire bonder designed for use in the manufacturing of semiconductor devices. It is used to attach gold-plated wire to the leads of integrated circuits, providing an electrical connection between the chip and the substrate. The bonder is equipped with powerful optics and intelligent software, allowing it to accurately, efficiently and reliably produce high-quality bonds. The bonder is driven by a Windows 7-based PC, and has a USB 2.0 connection which can be used to transfer programs, upgrades and other files. It has a built-in software program which enables the operator to quickly and easily set up the machine with a few simple steps. The powerful optics and powerful high-voltage generator offer stable, accurate and repeatable bond positions, with a maximum loop tension of 5g. Additionally, the bonder is able to automatically detect and adjust for misalignment of the wire, ensuring accurate and efficient bonding operations. For enhanced operation, the bonder has a built-in thermal imager which allows for rapid detection of wire breaks, potential shorts, opens and other defects. Additionally, the unit is equipped with a "no-strain" foot pedal, providing greater control and safety during bond operations. Finally, the bonder is equipped with both a micro-end tip and a heat-set tip, enabling the operator to produce a variety of bond wire lengths for different types of semiconductors. In conclusion, HUGHES 2470-1 is an automated wire bonder designed to improve efficiency, accuracy and reliability of manufacturing semiconductor products. It is equipped with powerful optics and intelligent software, allowing it to produce high-quality bonds with minimal user intervention. The sophisticated thermal imaging system and "no-strain" pedal offer greater control and safety while producing a variety of different bond wire lengths.
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