Used HUGHES / PALOMAR 2470-III #9205836 for sale

HUGHES / PALOMAR 2470-III is a compact, automated microelectronics bonding tool designed for low-cost and high-accuracy assembly of large quantities of electronic components. The product is a complete equipment, which includes the bondingstation, lathe, software, and fixturing to perform ultrasonic, thermocompression, wedge, and ball bonding processes with a minimum of operator intervention. HUGHES 2470-III has a generous X/Y work area and can accommodate components of all shapes and sizes, either loose or in trays. The system's software is designed to optimize the bonding parameters for each part type and is used to automate operation with significant reductions in setup time and operator effort. PALOMAR 2470-III's patented LatheDrive unit controls both the tooling and bonding locations with precision steering and accuracy exceeding 0.002". Its bonding head can accommodate a range of modular tooling chosen for the specific application, such as thermocouples, ultrasonic transducers, and other special tools. 2470-III machine also offers a number of other features, such as integrated vision, temperature control, and an intuitive graphical user interface. It has vision capability for inspection of part placement and spot resolution for critical bond points. Its temperature control helps to improve bond strength and cancel out any effects of environmental temperature changes. Its intuitive GUI is easy to learn and allows for rapid execution of part changes. Finally, programmable tracing facilitates repeat work without additional setup. HUGHES / PALOMAR 2470-III represents a values engineered hardware platform that utilizes a combination of mechanical, electrical, and software features to increase the functionality of the tool, while still providing a reliable, cost effective solution for modern microelectronics assembly requirements. With its ease of setup and automated control, HUGHES 2470-III provides an optimal assembly platform for low-cost, high-accuracy and robust assembly applications.