Used HUGHES / PALOMAR 2470-V #9268273 for sale

HUGHES / PALOMAR 2470-V is a highly specialized bonder used for the processing of microelectronic devices. This wire bonder is a fully automated machine, designed to solder and assemble components with utmost precision. It is capable of micro-welding thin wire bonding of wire diameters up to 0.001", allowing it to be used in the assembly of complex electrical circuits. It features a programmable industrial microprocessor, a precision pitch-feeder, and a vertical mounting mechanism that allow for precise positioning of the bonds. HUGHES 2470V can be programmed to bond at any position within a range of 0.2 - 5.00mm, and the bonder's pinpoint accuracy makes it ideal for micro-assemblies that use fine-gauge wire bonding and ultra-small components. PALOMAR 2470 V is powered by a programmable logic controller (PLC) which allows it to perform multiple functions in parallel. The bonder utilizes a numerical-controlled encoder and a highly advanced standard of motion control system, making it easy to perform precise wire bonding operations. HUGHES 2470-V is also capable of visual inspection and stitching of gold-chain brands, which has proven invaluable for production yields. 2470V is capable of processing various types of substrates, and is equipped with an ultrasonic transducer for superior control over power. The bonder also features an adjustable temperature range that allows for greater flexibility when it comes to soldering microelectronic components. Moreover, it boasts an extended bonder head life due to an extremely low head temperature when in operation. The efficient design of 2470-V makes it easy to handle and maintain, and it is also compatible with many industry-standard materials. This makes it the perfect choice for miniaturized structures and complex interconnects such as microcombos, flip-chips and ball-bonding. PALOMAR 2470-V is a powerful and reliable bonder for various types of, components. With its precision controls, highly advanced motors and unparalleled accuracy, it is the ideal solution for high precision wire bonding and assembly projects.