Used HUGHES / PALOMAR 3500-II #4131 for sale

HUGHES / PALOMAR 3500-II is a state-of-the-art wire bonder designed for microelectronic applications. It provides high quality, low cost performance and is suitable for applications ranging from R&D prototyping to large scale manufacturing. With its adjustable bond head, it can handle wire diameters from 0.25 to 1.25 mm and enables easy alignment of the wire with the contacts, as well as die-to-die alignment at different angles. HUGHES 3500-II includes a basic tool set, such as optical scanners, a wire tensioner, a bondhead switch and a full set of bonder-specific software, with capabilities to perform both ball and wedge bonds. The optical sensors provide the user with an accurate view of the underside of the wire, along with the contacts, allowing for precise placement of the electrode to the device body. PALOMAR 3500-II also features a temperature control system that varies the bondhead temperature depending on the wire, as well as an integrated thermal imaging camera for accurate quality assessment. It can bond both gold, silver or aluminum wire and ceramic, polymer, or even hard anodized aluminum carriers. The bonder is equipped with a solenoid driven power unit providing the user with a consistent and reliable bond current for all bond types. In addition to its versatile bonding capabilities, 3500-II system is capable of on-board diagnostics and includes a wide range of maintenance and calibration tools. Its automated real-time tuning module boosts uptime and troubleshooting by streamlining the user's process and ensuring repeatability. The system also provides detailed error reporting and data logging, helping operators identify and debug potential issues faster. Overall, HUGHES / PALOMAR 3500-II bonder is an excellent choice for microelectronic applications. With its adjustable bond head, temperature sensitive design, automated real-time tuning, and on-board diagnostics, HUGHES 3500-II offers users reliability and accuracy at an economical price.