Used HUGHES / PALOMAR 9000 #293621137 for sale

HUGHES / PALOMAR 9000 is an advanced automated wire bonder designed for use in high-performance, high-volume packages. This automated wire bonder is well-suited for the production of tight pitch and fine pitch ball bonds, as well as ribbon bonds and wedge bonds. Utilizing an encoder and high resolution optical alignment system, HUGHES 9000 offers excellent fine pitch accuracy and repeatability. The system also offers fast cycle time and has integrated automatic program filtering, designed to identify potential errors early in the process. PALOMAR 9000 offers multiple power stages to ensure maximum control at various wire sizes and lot sizes. The bonder features a waffle getter head, capable of accommodating a high-power laser, as well as an optional crimp head for longer wire leads. This model is also equipped with a large touch panel display for easy presentation and editing of module information. Along with the main panel, the bonder also features a powerful, user-friendly embedded software interface. This feature allows for greater customization and enhancement of the built-in processes; it also offers additional support for programming, troubleshooting, and optimization. To further enhance the system's flexibility and performance, 9000 can be equipped with a series of advanced vision modules, including the ability to detect black marks, proper lead placement and correct wire loop formation. In addition, the bonder also can be configured to enable the placement of optional accessories such as laser markers, laser welders and micron processors. These optional accessories can be used to ensure the reliable and robust operation of HUGHES / PALOMAR 9000. Finally, the bonder is designed with a robust, modular platform that provides maximum user-friendliness, with the ability to easily change and upgrade components as needed. All of these features, combined with its reliable and efficient operation, make HUGHES 9000 a great choice for high-volume, high-performance wire bonding applications.