Used HYBOND 512-10-31 #38074 for sale

HYBOND 512-10-31 is a high-speed, high-performance automated bonder developed for a range of bonding applications for printed circuit boards. Its advanced design and robust construction makes it an ideal solution for industrial production of precision Printed Circuit Boards (PCBs). This bonder utilizes the latest hybrid bonding technology, allowing it to achieve maximum bond strength while maintaining excellent adhesion performance even at high operating temperature of up to 350°C (662°F). The machine is well-suited to applications such as die attach, standoff, ledges and crimp applications. It is compatible with a range of substrates including FR4, polyimide, teflon and most PCB laminates. 512-10-31 has been designed with ease-of-use in mind. It features a simple to use graphical user interface (GUI) for programming, monitoring, and making data logs for quick debugging. It is capable of handling up to 512 separate channels, and operating simultaneously on each channel at up to 10 kHz (10,000 micro-steps per second). This allows for highly precise positioning, regardless of the complexity of the workpiece. HYBOND 512-10-31 is built for high-speed and reliability. The machine is built with advanced motion control technology, allowing it to function with minimal vibration and minimal noise. This machine comes with stage adapters and PCB support jigs, as well as a breathing case, temperature sensor and automated process control system. This ensures that the bonding process is highly repeatable, and provides superior accuracy and control. Thanks to its robust construction and advanced design, 512-10-31 is reliable and capable of handling a range of high-precision applications. Connectivity is also provided through a range of digital and analog outputs, making it easy to integrate into existing systems. The bonder is capable of working continuously even in harsh environments, and is perfect for all high-precision bonding applications, ensuring maximum overall performance in any production environment.