Used HYBOND 522A #9275498 for sale

HYBOND 522A Bonding Equipment is a reliable and versatile machine designed to meet the needs of high-throughput electronic assembly and packaging operations. It is a fully automated system that boasts an intuitive user interface and a variety of advanced features. It has a 5-axis active motion control unit that allows for precise placement of parts and solder paste deposits, as well as improved efficiency and quality. It is designed for throughputs up to 40 cycles/minute, making it suitable for fast-paced production environments. HYBOND 522 A is equipped with a double chamber oven for rapid reflow of solder paste deposits to provide stronger and more reliable solder joints. It also integrates an eight-zone reflow profile for temperature control during the dissolution of flux, providing flexibility and accuracy for a variety of material combinations. Additionally, 522A has a built-in no-clean liquid flux machine for dispensing fluxing agent during automation, eliminating the need for manual intervention. 522 A also features a programmable six-axis vision tool that allows for precise orientation, notch recognition, and real-time component identification. This asset ensures correct part placement and alignment before bonding, helping to reduce misalignment issues and ensuring the highest level of process repeatability. Additionally, a built-in fiducial camera model provides pattern recognition for precise component placement. To further increase reliability and efficiency, HYBOND 522A offers an optional side probe feature that helps detect and monitor open or defective joints prior to reflow to ensure no faulty joints are produced. Furthermore, to increase productivity, the machine has an adjustable bonder platform to accommodate any size of device, which is capable of being loaded in batches quickly and efficiently. In conclusion, HYBOND 522 A Bonding Equipment offers the impressive combination of precision and versatility, allowing for high-throughput production in a wide range of assembly and packaging operations. With its combination of automated features, advanced vision systems, and adjustable bonder platform, 522A provides an effective, cost-effective solution for any electronic assembly operation.