Used HYBOND 572-31 #9223600 for sale

HYBOND 572-31 is a mid-field bonder manufactured by OHyama Corporation. It is a fully automated, high-speed bonder with a wide range of bond types and sizes. It is capable of handling low to medium-sized gold, copper and aluminum wires and processes them at speeds of up to 30 characters per second. The bonder has a distinct vision system that can scan and detect the size, shape and position of the individual wire strands and accurately bond them in place. This makes it highly accurate and reliable in producing a secure and lasting bond. 572-31 is equipped with a multi-zone, variable temperature soldering chamber which can be programmed for different temperatures, making the entire bonding process more efficient. The heated chamber helps to ensure that the bond is uniform, uniformity of wire size and an even distribution of heat are achieved. The soldering chamber is also protected by a nitrogen atmosphere and is equipped with a hydrogen removal system that evaporates the vaporized solder to ensure that the surrounding environment is safe. HYBOND 572-31 is designed with a three-point laser guide that helps to ensure that each bond is accurate and uniform. The guide also helps to improve consistency and production times. Additionally, it is built with a special loop detector that identifies and adjusts the speed and direction of the wire so that it accurately aligns with the bond. This helps to increase the reliability and repeatability of the bond. 572-31 is also equipped with an in-line pressure regulator that helps to maintain the necessary pressure to make a secure bond. It allows for precise pressure control and prevents over pressurization that can cause damage to the wire. It also helps reduce waste PCBs due to misalignment of the wire during bonding. The pressure regulator is also able to detect minor defects in the wire, which helps to increase the quality of the bond. HYBOND 572-31 is a reliable and efficient bonder that can help to increase product quality and production times. Its various features enable it to bond low to medium-sized wires with high accuracy and reliability, while also protecting the surrounding environment and saving potential waste of PCBs due to misalignment. In all, 572-31 is an ideal solution for anyone requiring a mid-field bonder with an easy to use and reliable machine.