Used HYBOND 572 #9010605 for sale

HYBOND 572 is a fully automated robotic bonder designed for precision assembly and fast, high-speed packaging. This equipment is capable of performing a variety of bonding operations such as lead-free soldering, thermocompression bonding, and an array of wire bonding techniques. 572 is a robotic bonder with a dual robotic arm assembly, integrating the flexibility of servo technology and the accuracy of linear motor technology. It is equipped with a highly precise camera vision system and has integrated three-dimensional alignment, allowing for both manual and automated programming and self-alignment and calibration. The unit offers a range of process capabilities, with a range of pneumatic, thermal, and ultrasonic processes. It is capable of bonding sizes as small as 0.03mm and as large as 10cm, with resolution and precision down to an accuracy of 0.02millimeters. It can handle speeds up to 200 cycles per minute and can handle materials such as gold, silver, copper, aluminum, tin alloys, and plastic. The machine is also compatible with a variety of industrial adhesives, solder pastes, and lubricants. The integrated process control, monitoring, and fault detection features are built into the machine and are customizable for each individual application. These features track, monitor, and report both quality assurance and maintenance issues as needed. Process and setup parameters can be changed in real time. This allows for maximum quality assurance, reduces product scrap rates, and increases productivity. HYBOND 572 is designed for quick, easy setup and can recover quickly within minutes after a power outage. The tool offers a range of communication protocols for automated and remote control. It is designed for operation in a wide range of temperatures, humidity, and altitudes. This makes it suitable for use in medical and aerospace applications. The asset is also ETL and CE certified, providing safe and reliable operation. 572 is an efficient, reliable, and cost-effective solution for automating high-end, high-precision bonding operations. The model's comprehensive process control and monitoring features, as well as its ability to handle small as well as large parts, makes it an excellent choice for a wide range of industrial and manufacturing applications.