Used HYBOND 572 #9106386 for sale

HYBOND 572
Manufacturer
HYBOND
Model
572
ID: 9106386
Wire bonder.
HYBOND 572 is a high speed bonder used to adhere various materials together with light energy. It is commonly used in industries such as precision optics, medical, electronics, and semiconductor. 572 is an automated tool that is designed to offer precision bonding to a range of challenging materials with results that are highly repeatable and reliable. It's designed to deliver high performance bonding without compromising quality or workmanship. This bonder is versatile, allowing users to work with most standard and challenging materials such as metals, glass, ceramics, plastics and even semiconductor wafers. It utilizes advanced high-power Light Emitting Diodes (LEDs) to emit light and heat energy which is transmitted to the workpiece. The light energy is absorbed by the workpiece, then converted into localized heat while not having any residual radiation. This technology makes it highly efficient in bonding materials. The bonder features a stage that apposition system which accurately moves, rotates, and positions the workpiece in the exact desired location with minimal effort. It has a field of view, allowing you to easily observe the workpiece and make any necessary adjustments. The user-friendly touch-screen display helps to simplify setup and operation. HYBOND 572 also offers advanced safety features, such as a laser interlock system that will disable the laser source if it is not used for a set time, as well as an automatic shut-off in the event of an emergency. It is constructed with durable materials to ensure longevity and protection in tough industrial use. Overall, 572 is a specialized bonding tool that provides highly repeatable and reliable results when bonding difficult materials. It is designed to handle challenging jobs with maximum accuracy and efficiency while offering advanced safety features. This bonder will help to keep your operation running smoothly and provide you with the highest quality bonding results.
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